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Manufacturing Quality Management Flowchart SMT RROCESS
SMT RROCESS SMT Manufacturing (Surface Mount Technology)With high-precision, high-efficiency SMT production lines, we professionally mount various SMD components, ensuring stable quality and excellent efficiency to meet diverse customer needs.
STEP01
Material Requisition
STEP02
Material Preparation
STEP03
Programming
STEP04
Material Loading and Verification BOM and Materials
STEP05
Solder Paste Printing
STEP06
Medium- and High-Speed Machine Printing
STEP07
General-purpose machined parts
STEP08
IPQC inspection
STEP09
Reflow
STEP10
AOI
STEP11
Visual inspection
STEP12
QC
STEP13
DIP workstation
Jhenyu SMT Process CapabilityPROCESS CAPABILITY
PCB TypesSingle-sided, double-sided, multilayer boards, and various other PCB types (all sampleable)
PCB Substrate SizeMaximum 1200mm x 350mm
PCB Substrate Thickness3mm thick, 0.1mm thin
Component Size0201 R/C
Stencil Size735mm x 735mm
IC Lead pitch 0.2mm
BGA Ball pitch 0.3mm
Mounting machine precision (Chip/IC)Chip/IC : ±0.3mm
Printing machine precision±0.05mm
Production points1.5KK/day
Maximum PCB size1200mm x 350mm
Minimum R/C size01005
Minimum IC lead pitch0.3 mm
Minimum BGA ball diameter0.25mm/ball pitch: 0.45mm
SMT EQUIPMENT EQUIPMENT
